Wayne Lee
Field Application Engineering, Director at Spil 矽品
Based in San Francisco, United States
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Seniority
Other
Department
Other
Location
San Francisco
Industry
Semiconductor Manufacturing
Company size
1.6K
Contact information
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w•••••••@spil.com.tw
Phone
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Background
About Wayne Lee
Package Applications Engineering: NPI support & development for flip chip FCCSP/FCBGA…
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