William Lam
Vice President of Engineering at Toshiba America Electronic Components, Inc
Based in San Francisco, United States
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Seniority
Vp
Department
Engineering
Location
San Francisco
Industry
Consumer Electronics
Company size
272
Contact information
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w•••••••@toshiba.semicon-storage.com
Phone
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Background
About William Lam
Result-oriented executive with in-depth business experience and technical knowledge from hardware to software. Develop business and technical solutions for customers. Architect and incubate innovation and leading technologies. Work with all stakeholders to bring products from conception to mass production on schedule and first-time success. Extensive experience managing projects and products with customers. Create hundreds of millions of dollars in business revenue from product development to customer support in AI/ML, microprocessor, HPC, networking, and non-volatile storage. Datacenter – Storage, compute, and networking: business development, architecture, engineering, and support Machine Learning – Deployed industrial forefront ML platforms and accounted for initial revenue. Innovation and Productization – Innovated, demonstrated, and productized cutting edge technologies. Organizational Leadership – Built and managed company’s key contributing groups impacting global business. Engineering Management – Managed world-wide organizations (US, Asia, Europe) of 200+ in development, deployment, and support. Product Development – Developed 20+ SOCs and systems in automotive, ML, data center, and storage. Customer Engagement – Supported 100+ world-wide customers, resolving with min. schedule impact. Business Development – Raised design win rate by 250% accounting for 65% of silicon business. Planning and Budgeting – Negotiated and managed financial activities with headquarter and CFO. Policy Compliance – Collaborated with legal and HR to achieve 100% compliance of government/corporate policies.
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