Verified recordConsumer Electronics

William Lam

Vice President of Engineering at Toshiba America Electronic Components, Inc

Based in San Francisco, United States

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Seniority

Vp

Department

Engineering

Location

San Francisco

Industry

Consumer Electronics

Company size

272

Contact information

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Email

1 credit

w•••••••@toshiba.semicon-storage.com

Phone

5 credits

+1 ••• •••• ••••

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Background

About William Lam

Result-oriented executive with in-depth business experience and technical knowledge from hardware to software. Develop business and technical solutions for customers. Architect and incubate innovation and leading technologies. Work with all stakeholders to bring products from conception to mass production on schedule and first-time success. Extensive experience managing projects and products with customers. Create hundreds of millions of dollars in business revenue from product development to customer support in AI/ML, microprocessor, HPC, networking, and non-volatile storage. Datacenter – Storage, compute, and networking: business development, architecture, engineering, and support Machine Learning – Deployed industrial forefront ML platforms and accounted for initial revenue. Innovation and Productization – Innovated, demonstrated, and productized cutting edge technologies. Organizational Leadership – Built and managed company’s key contributing groups impacting global business. Engineering Management – Managed world-wide organizations (US, Asia, Europe) of 200+ in development, deployment, and support. Product Development – Developed 20+ SOCs and systems in automotive, ML, data center, and storage. Customer Engagement – Supported 100+ world-wide customers, resolving with min. schedule impact. Business Development – Raised design win rate by 250% accounting for 65% of silicon business. Planning and Budgeting – Negotiated and managed financial activities with headquarter and CFO. Policy Compliance – Collaborated with legal and HR to achieve 100% compliance of government/corporate policies.

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