Yahya Alvi

Senior Packaging R & d Engineer at Intel Corporation

Based in Overland Park, United States

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Seniority

Staff

Department

Engineering

Location

Overland Park

Industry

Semiconductor Manufacturing

Company size

110K

Contact information

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Email

1 credit

y•••••••@intel.com

Phone

5 credits

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Background

About Yahya Alvi

Innovative engineer with expertise in semiconductor packaging, process development, and…

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