Yf Chan

Head of Product Management Backend Packaging Group Operation Sustaining Engineering Owner at Manufacturing Integration Technology Ltd

Based in Singapore

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Seniority

Other

Department

Other

Location

Singapore

Industry

Automation Machinery Manufacturing

Company size

79

Contact information

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Email

1 credit

y•••••••@mit.com.sg

Phone

5 credits

+65 ••• •••• ••••

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Background

About Yf Chan

Project management and engineering development with over 25 years of semiconductor advance packaging experience. Dynamic individual with attention to details and a strong problem solver motivated by new technology and innovation. A good team leader with positive thinking and strong resolution skill to garner people to achieve project objective. Core Competencies * Project Management PMP trained * Design and Development of Semiconductor equipment * High mix Manufacturing production and operation ability * New Product Introduction (NPI)

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