Zhen Cui
Senior Engineer at Qualcomm
Based in Netherlands
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Seniority
Staff
Department
Engineering
Location
Netherlands
Industry
Semiconductor Manufacturing
Company size
53K
Contact information
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z•••••••@qualcomm.com
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Background
About Zhen Cui
Engineer in the field of microelectronic packaging and reliability. 5 years researching experience in the reliability of Cu BOEL, RDL, and μ-bump. More than 7-years of experience in FEM simulations, including the multi-physics (structural-thermal-electrical-diffusional) modeling for the DOE and failure analysis of packaging structures and components. 3 years experience on flexible si-based LED packages. Also, master for multi-scale modeling, including the first-principles calculation and MD (molecular dynamic) simulation.
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