Ziling Deng
Packaging Module Development Engineer at Intel Corporation
Based in United States
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Seniority
Staff
Department
Engineering
Location
United States
Industry
Semiconductor Manufacturing
Company size
110K
Contact information
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z•••••••@intel.com
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Background
About Ziling Deng
Semiconductor Packaging Development Engineer experienced in substrate packaging development, improve process capabilities through high performance packaging technologies for die attachments. Experienced in designing and using Ab Initio, machine learning and parallel supercomputing. Past research focuses including electronic properties and nanoscale interfaces in semiconductors and ferromagnetic materials with high transition temperatures.
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