Boschman Advanced Packaging Technology
Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.
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Verified contacts
75
available on Kipplo
LinkedIn employees
88
51 to 200 range
Open roles
—
no listings
Distinct roles
56
indexed titles
Tech stack
0
tools in use
Monthly traffic
2
organic / mo
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Decision-makers and verified team members
75 contacts with verified email or phone · masked until revealed.
- CH
Carlos Hendriksen
Productiemanager · Manufacturing & Production
EmailPhone - HD
Hans de Korte
Mechanical Design Engineer · Engineering
EmailPhone - EB
Erik Brouwer
Senior Mold Engineer - Project Manager at Boschman Technologies · Other
EmailPhone - SC
Scott Cheney
Sales Engineer · Other
EmailPhone - JD
Joost de Wolf
Head of Cam and Milling, Cnc Milling Machinist, Cnc Milling Programmer, Cam Programmer · Other
EmailPhone - HL
Hans Lucassen
Service Manager · Operations
EmailPhone - JB
Jason Boyd
Manager - Organisational Quality(Qa) Assembly Services · Other
EmailPhone - JP
Johan Peters
Lead Service Engineer · Engineering
EmailPhone - MH
Mike Hoedemaker
Lead Engineer Package Development, Film Assisted Molding Specialist · Other
EmailPhone
Showing 9 of 75 verified contacts
Top roles at Boschman Advanced Packaging Technology
56 distinct titles indexed · top 10 shown.
- 4mechanical engineer
- 3()
- 3process engineer
- 3purchaser
- 3technician
- 2assistant finance & administration
- 2mechanical design engineer
- 2package developement engineer
- 1account director east asia
- 1analyst
- +46more titles
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