Mike Hoedemaker
Lead Engineer Package Development, Film Assisted Molding Specialist at Boschman Advanced Packaging Technology
Based in Arnhem, Netherlands
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Seniority
Manager
Department
Other
Location
Arnhem
Industry
Semiconductor Manufacturing
Company size
88
Contact information
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m•••••••@boschman.nl
Phone
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Background
About Mike Hoedemaker
Specialist semiconductor molds Film Assist Molding and Sintering. Since 1995 developed…
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