Adarsh Das
Package Developement Engineer at Boschman Advanced Packaging Technology
Based in Arnhem, Netherlands
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Seniority
Other
Department
Other
Location
Arnhem
Industry
Semiconductor Manufacturing
Company size
88
Contact information
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a•••••••@boschman.nl
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Background
About Adarsh Das
At Boschman Advanced Packaging Technology, our team has pioneered enhancements in power module packaging, focusing on back-end processes like Sintering, Molding and Die attach. Our efforts have markedly improved product performance and reliability. With a Bachelor of Science in Mechanical Engineering from Rhine-Waal University, I bring a strong analytical foundation to our projects, utilizing Statistical Analysis to refine manufacturing processes. Leveraging skills in SOLIDWORKS alongside industry-specific knowledge in Film Assisted Molding and Silver and copper Sintering, I have contributed to elevating our R&D initiatives. My commitment lies in developing solutions that resonate with the evolving needs of the semiconductor sector. I stay current with technological advancements, ensuring that our approaches remain at the forefront of the industry.
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