Brice Arrazat

R & d at Stmicroelectronics

Based in Marseille, France

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Seniority

Staff

Department

Science

Location

Marseille

Industry

Semiconductor Manufacturing

Company size

35K

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Email

1 credit

b•••••••@st.com

Phone

5 credits

+33 ••• •••• ••••

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Background

About Brice Arrazat

SKILLS Design and conception - Finite element modeling (COMSOL Multiphysics and Zebulon)- SPICE models (UTMOST BSIM4)- Layout (KLayout, Expert and Calibre)- Spatial environment (OMERE and ESTAR) Theory - Physics of semi-conductor, electronic devices and photovoltaic - Materials characterizations and processes - Electrical contact and ohmic MEMS switch - Mechanics of crystalline solids and thin films Physical and electrical characterization - Particles contamination and haze measurement (Surfscans SP1DLS and SP2UV KLA Tencor)- Atomic force microscopy - Scanning electron microscopy - Electron backscattered diffraction (local crystalline orientation)- Nano-indenter XP (MTS)- Electrical characterization Microelectronics processes - Sputtering and evaporation - Ion implantation - Plasma etching, wet and vapor HF - Photolithography, nano-imprint SCIENTIFIC COLLABORATIONS French national agency of research project (FAME) on the reliability of ohmic MEMS switch (Laboratory fo Analysis and Architecture of Systems CNRS, NovaMEMS and CEA LETI MINATEC - France) Finite element modeling using crystal plasticity of rough surface deformation under spherical nano-indentation (Mines ParisTech CDM - France) 3D EBSD under Berkovich nano-indentation of gold thin film (Max Planck Institute - Germany) MEMS process release using critical point drying CO2 (Université Catholique de Louvain - Belgium) In-situ nano-indenter electrical contact resistance of gold stud bump on printed Ag nano-particles thin film (Gemalto - Ecole Nationale Supérieure des Mines de Saint Etienne CMP) Reliability of embedded Back-End of Line thermo-electro-mechanical sensor (STMicroelectronics - Mines ParisTech CEMEF) Mechanical properties of Al2O3 ultra-thin film deposited by ALD under low temperature (Encapsulix)

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