John Scharf

Engineer at Hp

Based in Denver, United States

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Seniority

Staff

Department

Engineering

Location

Denver

Industry

IT Services and IT Consulting

Company size

140K

Contact information

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Email

1 credit

j•••••••@hp.com

Phone

5 credits

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Background

About John Scharf

Metrology: Experienced with profilometers, spectrophotometers, X-ray fluorescence spectrometers, residual gas analyzers and inductively coupled plasma mass spectrometers. • Ultra High Vacuum: Experienced with positive displacement pumps and vacuum pumps, including cryogenic pumps, turbomolecular pumps and titanium sublimation pumps. Experienced with various pressure gauges, including convectron gauges, ion gauges and capacitance manometers. • Thin Film Deposition and Processing: Deposited thin films via CVD, CBD, PVD, MBE and sputtering techniques. Processed photovoltaic devices, and performed lithographic device isolation. Prepared homogeneous aqueous solutions for CBD. • Environmental Testing: Experienced with environmental chambers for determining the effects of extreme temperatures and humidity. Experienced with piezoelectronics and spectrum analyzers for vibration measurements. • Analysis: Performed data collection, and data reduction and error analysis. Experienced with logic analyzers and data loggers. • Electrical Systems: Experienced with designing systems utilizing three-phase electric power, and load balancing between phases. Experienced with instrumentation and control systems. • PCB/PCBA: Four years experience with the design and debug of high-speed printed circuit boards. Redesigned PCBs and electronic equipment for electro-magnetic compatibility. • Programming: Wrote programs in C/C++, FORTRAN and Pascal in a UNIX and Common Desktop environment to perform physical modeling and simulations, and complex calculations using numerical techniques. Experienced with LabVIEW.

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