Pascal Talbot

Background

About Pascal Talbot

Currently Assembly Coordinator for Caen team business line PLS (Power and Lighting Solution), I’m in charge of: • The study and qualification, up to the release for production, of the electronic packages needed for our new LED drivers and other power supply adapters, as well as packages for other business lines • To define and follow, up to the release for production, the qualification strategy for those products developed in a multi-sites environment with the assembly and test based in Asia • To perform the thermal analysis and measurement of these products Another program under my responsibility is to enhance the robustness to moisture (MSL level) of NXPs’ HVQFN packages. This is also done with a multi-sites team, where I’m the leader for Caen site. From a previous function, I belonged to Back-End Innovation group. I was project leader in the Caen Assembly Pilot Line, where my main function inside the Innovation Group was to define new technologies and lead complex projects that result in customer satisfaction. Some examples were: • Full development until the industrial phase of an electronic pill with RF transmission of physiological parameters for veterinary or medical purpose. • Realization of micro-flash prototypes for handset phone • Study of low cost interconnection technology based on tin-copper metals • Study and implementation of a jetting process followed by transfer to our Philippines based factory Some years ago, I also was project leader for the development of a GSM-DCS power amplifier module on laminate. I experienced a close partnership for the industrialization with a big company based to the USA. I was also In charge of the electronic components assembly lab. Long time ago I was in charge of photocathode developments for night vision investigations. My main contribution was the conception of an ultra-vacuum equipment for the study of light sensitivity of GaAs photocathode intended for intensifier image sensors. Specialties: • Advanced microelectronic packages and new assembly concept processes for high integration • Design: hyper frequency circuits; mechanical and micromechanical developments • Technique: hyper-frequency characterizations; vacuum and ultra-high vacuum; 3D modeling • Methodology: FMEA; PDCA; problem resolution • Projects leading and tracking • Software: Solid Works; MindView; Marc-Mentat; Cadence Virtuoso; MS Pack Office; Visio