Wayne Mu
Lead Engineer at Boschman Advanced Packaging Technology
Based in Duiven, Netherlands
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Seniority
Manager
Department
Engineering
Location
Duiven
Industry
Semiconductor Manufacturing
Company size
88
Contact information
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w•••••••@boschman.nl
Phone
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Background
About Wayne Mu
Expertise in power packaging and module SSC, DSC, DCM and CMOS associated packaging LGA, DFN, WLCSP, TSV, SIP and 3D integration • Solid knowledge of silicon process, packaging, assembly, PCB, reliability and failure analysis, subcontractor management • open-minded • sociable • team spirit
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